XP-170-LP
XP-170 is a DSLAM compatible with G.SHDSL.bis that simultaneously supports EFM (IEEE 802.3ah compliant) technology and N2N bonding technology. It provides a long distance Ethernet connection solution as a multi LAN expansion platform using metal lines in places where optical network construction is difficult.
With 24 lines of DSL interface, up to 5.7 Mbps Ethernet connection per line is possible, LAN extension connection from center station to multipoint with ETHX - 3000/2100 (CPE) with single pair or multi - pair.
Also, it now supports 1 Mb (2-wire) speed up to 10 M (extension rate).
With 24 lines of DSL interface, up to 5.7 Mbps Ethernet connection per line is possible, LAN extension connection from center station to multipoint with ETHX - 3000/2100 (CPE) with single pair or multi - pair.
Also, it now supports 1 Mb (2-wire) speed up to 10 M (extension rate).
| SHDSL | ma5.7Mbps（Max10Mbps）， 24Port（Telco50pin） |
| LAN Interface | 10/100/1000Mbps， RJ45×1Port，SFP×1Port（SFP- Sold Separately） |
| Operating Requirements | Temperature： -40～65℃，Humidity：5～85％（non-condensing），AC Adapter Option（0～50℃） |
| Specifications | Dimensions： 43.7（H） ｘ 439.7（W） x 254.4（D） [mm]，Weight： 3.6 [Kg]，Power ： -48VDC （AC Adapter Option) |
| Management & Network | WEB Management／CLI（Telnet・Serial）／SNMP，Bonding，VLAN，QoS，Bridge，Router |
| Compliance | NEBS: GR-63-CORE, GR-1089-CORE，EMC: FCC Part68&15; CSA/C108.8; EN55022A/55024/50082，Safety: UL1950, CSA C22.2 No. 950; EN/IEC/UL60950, CE Marking |
G.SHDSL.bis Concentrator 5.7M / 11.4M 24 Lines -40/+65℃（Main Unit） Bonding
